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Layer : 6L ; Base Material : FR4 ; Board Thickness : 1.7mm ; Final Copper Thickness : 1OZ ; Surface Finished: ENIG ; Unit Size(mm) : 340.0*180.0 ; Panel Size(mm) : 340.0*196.0 ; Min Hole Copper Thickness : 20um ; Min W/S(mil) : 5.9/8.66 ; Solder Mask : White ( in accordance with IPC-SM-840) ;
https://www.hoyogo.com/Products/6LPCBHYG898R06174A.htmlLayer : 6L ; Base Material : FR4 ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finished: ENIG ; Unit Size(mm) : 363.22*125.73 ; Min hole size : 0.2mm ; Min Hole Copper Thickness : 25um ; Min W/S(mil) : 4/4.9 ;
https://www.hoyogo.com/Products/6LFR4HYG898R06098A.htmlLayer: 6 ; Base Material: FR4 IT-158 ; Board Thickness:1.574mm ; Unit size: 29.000 x 197.000mm ; &nbs...
https://www.hoyogo.com/Products/6LFR4IT-158ENIGThick.html; Product detail ; ; Layer: 6L Base Material： FR4 TG170 Board Thickness: 1.6mm Unit Size: 46.5 x 52.7 Min hole size: 0.25mm Panel Size: 108.4 x 76 ...
https://www.hoyogo.com/Products/6LFR4TG17016mm.html
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