ENIG

6L PCB|HYG898R06174A

Layer : 6L ; Base Material : FR4 ; Board Thickness : 1.7mm ; Final Copper Thickness : 1OZ ; Surface Finished: ENIG ; Unit Size(mm) : 340.0*180.0 ; Panel Size(mm) : 340.0*196.0 ; Min Hole Copper Thickness : 20um ; Min W/S(mil) : 5.9/8.66 ; Solder Mask : White ( in accordance with IPC-SM-840) ;

HYG2203R02001A

Layer: 2L ; Base Material: FR4 TG130 ; Board Thickness: 1.0mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 104*96*14.70 ; Panel Size(mm): 114.96*108.79 ; Min W/S(mil): 6/5 ; Min Hole Size: 0.25mm ; Solder Mask: Black ;

HYG802R01005A

Layer : 1L ; Base Material : PI ; Board Thickness : 0.155mm ; Final Copper Thickness : 35um ; Surface Finished : ENIG ; Coverlay : Yellow ;

HYG807R02028A

Gold Finger PCB ; Layer : 2L ; Base Material : FR4 KB6160 TG130 ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 87.0*65.4 ; Panel Size(mm) : 174.0*130.8 ;

HYG305R06001A

Layer : 6L ; Base Material : FR4 ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 95.0*112.0 ; Panel Size(mm) : 244.0*200.0 ; Min Hole Copper Thickness : 25um ; Min W/S(mil) : 5.9/5.5 ;

HYG026R02009B

Layer : 2L ; Base Material : FR4 ; Board Thickness : 1.57mm ; Final Copper Thickness : 2OZ ; Surface Finished : ENIG+Gold Finger ; Unit Size(mm) : 101.59*101.59 ; Panel Size(mm) : 218.44*218.44 ;

HYG898R08005A

Layer : 8L ; Base Material : FR4 ; Board Thickness : 1.65mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 66.5*63.0 ; Panel Size(mm) : 133.0*146.0 ; Min W/S(mil) : 7/7 ; Min Hole Size : 0.2mm ; Solder Mask : Green Matt ;

HYG293R02323B | Electric Thick Gold

Layer: 2L ; Base Material: FR4 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG+Electric Thick Gold min 5U'' ; Unit Size(mm): 185.0*110.0 ; Panel Size(mm): 250.0*205.0 ; Min W/S(mil): 7.9/8.0 ;

HYG890R04008A

Layer : 4L ; Base Material : FR4 TG170 ; Board Thickness : 1.57mm ; Final Copper Thickness : 2OZ ; Surface Finished : ENIG ; Unit Size(mm) : 203.2*63.5 ; Panel Size(mm) : 213.2*391.0 ; Solder Mask : Blue ;

HYG528R04370A

Layer : 4L ; Base Material : FR4 ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 71.0*71.8 ; Panel Size(mm) : 213.0*215.4 ; Min W/S(mil) : 11.8/6.9 ; Min Hole Size : 0.3mm ; Solder Mask : White ;

HYG089R04243A

Layer : 4L ; Base Material : FR4 TG130 ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 77.6*107.0 ; Panel Size(mm) : 123.0*236.2 ; Min W/S(mil) : 5.9/5.9 ; Min Hole Size : 0.3mm ; Solder Mask : Black ; Solder Mask Thickness : min 10um ;

6L ENIG|HYG892R06307A

Layer : 6L ; Base Material : FR4 ; Board Thickness : 1.5mm ; Surface Finished :  ENIG ; Unit Size(mm) : 160.0*100.0 ; Panel Size(mm) : 180.0*225.0 ; Min Hole Copper Thickness : 20um ;

HYG904R04004A

Layer : 4L ; Base Material : FR4 TG150 ; Board Thickness : 1.575mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 127.00*218.00 ; Panel Size(mm) : 274.32*238.76 ; Min W/S(mil) : 5/10 ; Solder Mask : Blue ;

24Layer ENIG PCB

HYG892R02069C

Layer : 2L ; Base Material : FR4 TG130 ; Board Thickness : 1.5mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 140.0*45.0 ; Panel Size(mm) : 140.0*225.0 ; Solder Mask : Black matt ;

2 Layer FR4 CTI175 ENIG White

Layer:2 ; Base Materia：FR4 CTI175 ; Board Thickness:0.3mm ; Unit Size:10x218mm ; W/S:11.8/7.9 ; Copper OZ:52.9um ; Surface Finishing:ENIG Thickness ; Solder Mask:White ; Our company can offer a massive order with cost reduction for 15%, a discount ensuring quality ...

HYG021R08011B

Layer : 8L ; Base Material : FR4 ; Board Thickness : 1.22mm ; Surface Finished : ENIG ; Unit Size(mm) : 100.0*120.0 ; Min W/S(mil) : 3.5/4.1 ; Min Hole Size : 0.2mm ; Special Request : BGA ;

4 Layer FR4 TG135 ENIG Thickness

Layer:4 ;    Base Material:FR4 TG135 ;     Board Thickness:1mm ;  Unit size:16.41x24.79mm ; W/S: ...

6L FR4 IT-158 ENIG Thickness

Layer:  6 ; Base Material: FR4 IT-158 ;   Board Thickness:1.574mm ;   Unit size: 29.000 x 197.000mm ;  &nbs...

HYG892R04331A

Layer : 4L ; Base Material : FR4 ; Board Thickness : 1.5mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 264.7*107.7 ; Panel Size(mm) : 264.7*107.7 ; Min Hole Copper Thickness : 20um ; Min W/S(mil) : 7.9/7.9 ;

1 Layer FR4 0.13 8up ENIG

Layer:1   ;    Base Material:FR4 ;    Board Thickness:0.13mm ;  Unit size:250x135mm ;  Up number...