Layer : 4L
Base Material : FR4 TG130
Board Thickness : 1.6mm
Final Copper Thickness : 1OZ
Surface Finished : ENIG
Unit Size(mm) : 77.6*107.0
Panel Size(mm) : 123.0*236.2
Min W/S(mil) : 5.9/5.9
Min Hole Size : 0.3mm
Solder Mask : Black
Solder Mask Thickness : min 10um
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.