Layer : 1L ; Base Material : ALU 1W/MK ; Board Thickness : 1.0mm ; Final Copper Thickness : 1OZ ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 15.0*340.0 ; Panel Size(mm) : 160.0*340.0 ; Solder Mask : Black ;
https://www.hoyogo.com/Products/AluminumPCBHYG709A01.htmlLayer: 2L ; Base Material: FR4 TG130 ; Board Thickness: 1.0mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 104*96*14.70 ; Panel Size(mm): 114.96*108.79 ; Min W/S(mil): 6/5 ; Min Hole Size: 0.25mm ; Solder Mask: Black ;
https://www.hoyogo.com/Products/HYG2203R02001A.htmlLayer : 2L ; Base Material : FR4 ; Board Thickness : 0.9mm ; Final Copper Thickness : 2OZ ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 100*50 ; Panel Size(mm) : 300*120 ; Solder Mask : Black ;
https://www.hoyogo.com/Products/HYG089R02017A.htmlLayer : 4L ; Base Material : FR4 TG130 ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 77.6*107.0 ; Panel Size(mm) : 123.0*236.2 ; Min W/S(mil) : 5.9/5.9 ; Min Hole Size : 0.3mm ; Solder Mask : Black ; Solder Mask Thickness : min 10um ;
https://www.hoyogo.com/Products/HYG089R04243A.htmlLayer : 1L ; Base Material : Alu 2W/MK ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 25.84*25.75 ; Panel Size(mm) : 136.0*164.0 ; Solder Mask : Black ;
https://www.hoyogo.com/Products/HYG709R01006A.html