Layer: 2L
Base Material: FR4 TG130
Board Thickness: 1.0mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 104*96*14.70
Panel Size(mm): 114.96*108.79
Min W/S(mil): 6/5
Min Hole Size: 0.25mm
Solder Mask: Black
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.