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HYG021R08011B

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HYG021R08011B
HYG021R08011B
HYG021R08011B
Product Details

Layer : 8L

Base Material : FR4

Board Thickness : 1.22mm

Surface Finished : ENIG

Unit Size(mm) : 100.0*120.0

Min W/S(mil) : 3.5/4.1

Min Hole Size : 0.2mm

Special Request : BGA

Production process

ISO Certification

UL Certification

Application areas

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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