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Layer: 4L ; Base Material: FR4 ; Board Thickness: 1.7mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 105.0*109.5 ; Panel Size(mm): 119.06*228.06 ; Min W/S(mil): 6.3/6.3 ; Min Hole Size: 0.2mm ; Special Request: BGA ;
https://www.hoyogo.com/Products/HYG718R04008B.htmlBGA PCB ; Layer: 6L ; Base Material: FR4 TG150 ; Board Thickness : 1.6mm ; Final Copper Thickness: 2OZ ; Surface Finished: ENIG ; Unit Size(mm): 144.0*104.0 ; Min W/S(mil): 5/5 ; Min Hole Size: 0.2mm ;
https://www.hoyogo.com/Products/HYG089R06079A.htmlLayer: 4L ; Base Material: FR4 TG130 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 50.0*71.5 ; Panel Size(mm): 74.5*219.0 ; Min W/S(mil): 8/8 ; Min Hole Size: 0.2mm ; Special Request: BGA ;
https://www.hoyogo.com/Products/HYG021R04022A-BGA.htmlLayer: 2L ; Base Material: FR4 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: OSP ; Unit Size(mm): 170.0*210.0 ; Panel Size(mm): 170.0*210.0 ; Min W/S(mil): 3.94/4 ; Min Hole Size: 0.3mm ; Special Request: BGA ;
https://www.hoyogo.com/Products/HYG718R02021A.htmlLayer: 6L ; Base Material: FR4 S1000-2 TG170 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 233.35*160.0 ; Panel Size(mm): 233.35*160.0 ; Min W/S(mil): 5/6 ; Min Hole Size: 0.2mm ; Special Request: BGA ;
https://www.hoyogo.com/Products/HYG812R06043A.htmlLayer: 8L ; Base Material: FR4 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 125.0*113.0 ; Panel Size(mm): 125.0*127.06 ; Min W/S(mil): 4/4 ; Min Hole Size: 0.15mm ; Special Request: BGA ; Solder Mask Thickness :min 8um ;
https://www.hoyogo.com/Products/HYG718R08012A.htmlLayer: 4L ; Base Material: FR4 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 89.3*40.0 ; Panel Size(mm): 271.9*142.0 ; Min W/S(mil): 4.7/5 ; Min Hole Size: 0.2mm ; Special Request: BGA ;
https://www.hoyogo.com/Products/HYG089R04161A.htmlLayer : 8L ; Base Material : FR4 ; Board Thickness : 1.22mm ; Surface Finished : ENIG ; Unit Size(mm) : 100.0*120.0 ; Min W/S(mil) : 3.5/4.1 ; Min Hole Size : 0.2mm ; Special Request : BGA ;
https://www.hoyogo.com/Products/HYG021R08011B.htmlSpecial Request: BGA Layer: 8L Base Material: FR4 Board Thickness: 1.68mm Final Copper Thickness: 1OZ Surface Finished: ENIG Unit Size(mm): 220.0*100.0 Panel Size(mm): 240.0*120.0 Min W/S(mil): 3.9/3.9 Min Hole Size: 0.15mm Solder Mask: Gre...
https://www.hoyogo.com/BGA-PCB.htmlLayer: 6L Base Material: FR4 TG135 Board Thickness: 0.787mm Final Copper Thickness: 1OZ Surface Finished: ENIG Unit Size(mm): 12.7*66.04 Panel Size(mm): 96.52*86.36 Min W/S(mil): 6/5 Min Hole Size: 0.15mm Special Request: BGA
https://www.hoyogo.com/6-Layer-BGA-PCB.htmlLayer: 8L Base Material: FR4 TG150 Board Thickness: 1.6mm Final Copper Thickness: 1OZ Surface Finished: ENIG+Impedance Control Unit Size(mm): 36.57*51.88 Panel Size(mm): 192.86*207.53 Min W/S(mil): 3.5/4.0 Min Hole Size: 0.2mm Solder Mask: Blue Special Request: BGA
https://www.hoyogo.com/Impedance-Control-BGA-PCB.html
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