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Products

HYG089R06079A

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HYG089R06079A
Product Details

BGA PCB

Layer: 6L

Base Material: FR4 TG150

Board Thickness : 1.6mm

Final Copper Thickness: 2OZ

Surface Finished: ENIG

Unit Size(mm): 144.0*104.0

Min W/S(mil): 5/5

Min Hole Size: 0.2mm

Production process

ISO Certification

UL Certification

Application areas

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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