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Customer service hotline:+86 13723413985 or 400 058 2288
Layer: 8L
Base Material: FR4
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 125.0*113.0
Panel Size(mm): 125.0*127.06
Min W/S(mil): 4/4
Min Hole Size: 0.15mm
Special Request: BGA
Solder Mask Thickness :min 8um
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.
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