8 Layer PCB

HYG718R08012A

Layer: 8L ; Base Material: FR4 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 125.0*113.0 ; Panel Size(mm): 125.0*127.06 ; Min W/S(mil): 4/4 ; Min Hole Size: 0.15mm ; Special Request: BGA ; Solder Mask Thickness :min 8um ;