Layer : 4L
Base Material : FR4 TG170
Board Thickness : 1.575mm
Final Copper Thickness : 2/1/1/2OZ
Surface Finished : ENIG
Unit Size(mm) : 95.25*234.95
Panel Size(mm) : 95.25*234.95
Min Hole Copper Thickness : 20um
Min W/S(mil) : 9.8/9.8
Solder Mask Thickness : min 10um
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.