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Products

long FPC|HYG306F02019A

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long FPC|HYG306F02019A
Product Details

Layer : 2L

Base Material : PI 50UM

Board Thickness : 146+/-30

Final Copper Thickness : 15um

Surface Finishing: ENIG

Unit Size(mm) : 3.18*755.0

Panel Size(mm) : 58.0*770.0

Min hole size : 0.1mm

Min Hole Copper Thickness : 12um

W/S(mil) : 3.94/3.94

Solder Mask : green+yellow coverlay   Bottom yellow coverlay

Silkscreen : /

ISO Certification

UL Certification

Application areas

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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