Layer : 2L
Base Material : PI 50UM
Board Thickness : 146+/-30
Final Copper Thickness : 15um
Surface Finishing: ENIG
Unit Size(mm) : 3.18*755.0
Panel Size(mm) : 58.0*770.0
Min hole size : 0.1mm
Min Hole Copper Thickness : 12um
W/S(mil) : 3.94/3.94
Solder Mask : green+yellow coverlay Bottom yellow coverlay
Silkscreen : /
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.