Layer : 2L
Base Material : PI
Board Thickness : 0.28mm
Final Copper Thickness: 65um
Surface Finished : ENIG
Unit Size(mm) : 401.95*434.99
Panel Size(mm) : 401.95*434.99
Min Hole Copper Thickness : 20um
Min W/S(mil) : 8/8
Coverlay : Yellow
FR4 stiffener
base material brand : SF 302
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.