Gold finger

HYG807R02028A

Gold Finger PCB ; Layer : 2L ; Base Material : FR4 KB6160 TG130 ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 87.0*65.4 ; Panel Size(mm) : 174.0*130.8 ;

Gold Finger 30u\"

Layer : 8L ; Base Material : FR4 ; Board Thickness : 1.6mm ; Surface Finished : ENIG+ Gold Finger 30u" ; Solder Mask : Blue ;

HYG1103R02021A

Layer : 2L with NPTH ; Base Material : FR4 ; Board Thickness : 0.33mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG+Gold Finger ; Unit Size(mm) : 94.15*16.00 ; Min W/S(mil) : 11.8/11.8 ; Solder Mask : Yellow Coverlay ; Stiffener Size : 5.0±0.5mm ;

HYG026R02009B

Layer : 2L ; Base Material : FR4 ; Board Thickness : 1.57mm ; Final Copper Thickness : 2OZ ; Surface Finished : ENIG+Gold Finger ; Unit Size(mm) : 101.59*101.59 ; Panel Size(mm) : 218.44*218.44 ;

HYG882F01018A

Layer : 1L ; Base Material : PI ; Board Thickness : 0.13mm ; Final Copper Thickness : 0.5OZ ; Surface Finished : ENIG+Gold Finger ; Unit Size(mm) : 367.03*15.24 ; Min W/S(mil) : 15.75/14 ; Solder Mask : Black ;

HYG896R04012A

Layer : 4L ; Base Material : FR4 ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG+Gold Finger ; Panel Size(mm) : 232.00*161.03 ;

FR4 stiffener|HYG528F02159

Layer : 2L ; Base Material : PI ; Board Thickness : 0.28mm ; Final Copper Thickness: 65um ; Surface Finished : ENIG ; Unit Size(mm) : 401.95*434.99 ; Panel Size(mm) : 401.95*434.99 ; Min Hole Copper Thickness : 20um ; Min W/S(mil) : 8/8 ; Coverlay : Yellow ; FR4 stiffener ; base material brand : SF...

4Layer Gold finger PCB

HYG026R02009B|Gold Finger

Layer: 2L ; Base Material: FR4 ; Board Thickness: 1.6mm ; Final Copper Thickness: 2OZ ; Surface Finished: ENIG+Gold Finger ; Unit Size(mm): 101.59*101.59 ; Panel Size(mm): 218.44*218.44 ; Min W/S(mil): 8/8 ; Min Hole Size: 0.2mm ;

Gold Finger PCB

Layer: 6L Base Material: FR4 Board Thickness: 1.55mm Final Copper Thickness: 2OZ Surface Finished: ENIG+Gold Finger Unit Size(mm): 131.0*68.9 Panel Size(mm): 151.0*139.8 Min W/S(mil): 5.9/5.9 Min Hole Size: 0.2mm Special Request: BGA

HYG892R08346A

Layer: 8L ; Base Material: FR4 TG150 CT1＞175 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG+Gold Finger ; Unit Size(mm): 120.0*78.0 ; Panel Size(mm): 120.0*78.0 ; Min W/S(mil): 8/8 ; Min Hole Size: 0.2mm ; Solder M...

Gold Finger PCB | HYG1027R02002A

Special Request:  1. Gold Finger(Au: Min. 0.8um, Ni: Min. 2.5um) 2. Beveling Layer: 2L Base Material: FR4 TG170 Board Thickness: 1.6mm Final Copper Thickness: 2OZ Surface Finished: ENIG+Gold finger Unit Size(mm): 36.40*39.20