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HYG892R08346A

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HYG892R08346A
Product Details

Layer: 8L

Base Material: FR4 TG150 CT1＞175

Board Thickness: 1.6mm

Final Copper Thickness: 1OZ

Surface Finished: ENIG+Gold Finger

Unit Size(mm): 120.0*78.0

Panel Size(mm): 120.0*78.0

Min W/S(mil): 8/8

Min Hole Size: 0.2mm

Solder Mask: Green Matt

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.


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