Gold Finger PCB

HYG1103R04016A

Layer : 6L ; Base Material : FR4 TG150 ; Board Thickness : 1.65mm ; Surface Finished : ENIG+Gold Finger ; Unit Size(mm) : 60.0*79.0 ; Panel Size(mm) : 247.0*300.0 ; Min W/S(mil) : 7.9/7.9 ; Min Hole Size : 0.3mm ; Solder Mask Thickness : Trace Edge 7um(min); Trace Surface 10um(min) ;

HYG026R02009B

Layer : 2L ; Base Material : FR4 ; Board Thickness : 1.57mm ; Final Copper Thickness : 2OZ ; Surface Finished : ENIG+Gold Finger ; Unit Size(mm) : 101.59*101.59 ; Panel Size(mm) : 218.44*218.44 ;

HYG896R04012A

Layer : 4L ; Base Material : FR4 ; Board Thickness : 1.6mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG+Gold Finger ; Panel Size(mm) : 232.00*161.03 ;

4Layer Gold finger PCB

HYG026R02009B|Gold Finger

Layer: 2L ; Base Material: FR4 ; Board Thickness: 1.6mm ; Final Copper Thickness: 2OZ ; Surface Finished: ENIG+Gold Finger ; Unit Size(mm): 101.59*101.59 ; Panel Size(mm): 218.44*218.44 ; Min W/S(mil): 8/8 ; Min Hole Size: 0.2mm ;

HYG909R04004A

Layer : 4L ; Base Material : FR4 TG170 ; Board Thickness : 1.575mm ; Final Copper Thickness : 1OZ ; Surface Finished : HASL Lead Free+Gold Finger ; Unit Size(mm) : 95.25*69.85 ; Panel Size(mm) : 152.40*214.63 ; Min W/S(mil) : 8/5 ; Min Hole Size : 0.25mm ; Solder Mask : Blue ;

Rigid-Flex PCB

Layer : 6L ; Base Material+Stack-up : FR4+PI ; Board Thickness : 1.6mm+0.4mm ; Surface Finished : ENIG+Gold Finger ; Min Hole Size : 0.25mm ; Illustration : Industry Control ;

Gold Finger PCB

Layer: 6L Base Material: FR4 Board Thickness: 1.55mm Final Copper Thickness: 2OZ Surface Finished: ENIG+Gold Finger Unit Size(mm): 131.0*68.9 Panel Size(mm): 151.0*139.8 Min W/S(mil): 5.9/5.9 Min Hole Size: 0.2mm Special Request: BGA

HYG892R08346A

Layer: 8L ; Base Material: FR4 TG150 CT1＞175 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG+Gold Finger ; Unit Size(mm): 120.0*78.0 ; Panel Size(mm): 120.0*78.0 ; Min W/S(mil): 8/8 ; Min Hole Size: 0.2mm ; Solder M...

Gold Finger PCB | HYG1027R02002A

Special Request:  1. Gold Finger(Au: Min. 0.8um, Ni: Min. 2.5um) 2. Beveling Layer: 2L Base Material: FR4 TG170 Board Thickness: 1.6mm Final Copper Thickness: 2OZ Surface Finished: ENIG+Gold finger Unit Size(mm): 36.40*39.20