Layer : 6L
Base Material : FR4 TG150
Board Thickness : 1.65mm
Surface Finished : ENIG+Gold Finger
Unit Size(mm) : 60.0*79.0
Panel Size(mm) : 247.0*300.0
Min W/S(mil) : 7.9/7.9
Min Hole Size : 0.3mm
Solder Mask Thickness : Trace Edge 7um(min); Trace Surface 10um(min)
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.