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Layer : 6L ; Base Material : FR4 TG150 ; Board Thickness : 1.65mm ; Surface Finished : ENIG+Gold Finger ; Unit Size(mm) : 60.0*79.0 ; Panel Size(mm) : 247.0*300.0 ; Min W/S(mil) : 7.9/7.9 ; Min Hole Size : 0.3mm ; Solder Mask Thickness : Trace Edge 7um(min); Trace Surface 10um(min) ;
https://www.hoyogo.com/Products/HYG1103R04016A.htmlLayer : 2L with NPTH ; Base Material : FR4 ; Board Thickness : 0.33mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG+Gold Finger ; Unit Size(mm) : 94.15*16.00 ; Min W/S(mil) : 11.8/11.8 ; Solder Mask : Yellow Coverlay ; Stiffener Size : 5.0±0.5mm ;
https://www.hoyogo.com/Products/HYG1103R02021A.htmlLayer : 4L ; Base Material : FR4 TG170 ; Board Thickness : 1.575mm ; Final Copper Thickness : 1OZ ; Surface Finished : HASL Lead Free+Gold Finger ; Unit Size(mm) : 95.25*69.85 ; Panel Size(mm) : 152.40*214.63 ; Min W/S(mil) : 8/5 ; Min Hole Size : 0.25mm ; Solder Mask : Blue ;
https://www.hoyogo.com/Products/HYG909R04004A.html
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