Layer : 2L with NPTH
Base Material : FR4
Board Thickness : 0.33mm
Final Copper Thickness : 1OZ
Surface Finished : ENIG+Gold Finger
Unit Size(mm) : 94.15*16.00
Min W/S(mil) : 11.8/11.8
Solder Mask : Yellow Coverlay
Stiffener Size : 5.0±0.5mm
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.