Gold Finger Rigid PCB

HYG1103R02021A

Layer : 2L with NPTH ; Base Material : FR4 ; Board Thickness : 0.33mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG+Gold Finger ; Unit Size(mm) : 94.15*16.00 ; Min W/S(mil) : 11.8/11.8 ; Solder Mask : Yellow Coverlay ; Stiffener Size : 5.0±0.5mm ;