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Gold Finger PCB Manufacturer

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HYG1103R04016A
Layer : 6L ; Base Material : FR4 TG150 ; Board Thickness : 1.65mm ; Surface Finished : ENIG+Gold Finger ; Unit Size(mm) : 60.0*79.0 ; Panel Size(mm) : 247.0*300.0 ; Min W/S(mil) : 7.9/7.9 ; Min Hole Size : 0.3mm ; Solder Mask Thickness : Trace Edge 7um(min); Trace Surface 10um(min) ;
https://www.hoyogo.com/Products/HYG1103R04016A.html
HYG909R04004A
Layer : 4L ; Base Material : FR4 TG170 ; Board Thickness : 1.575mm ; Final Copper Thickness : 1OZ ; Surface Finished : HASL Lead Free+Gold Finger ; Unit Size(mm) : 95.25*69.85 ; Panel Size(mm) : 152.40*214.63 ; Min W/S(mil) : 8/5 ; Min Hole Size : 0.25mm ; Solder Mask : Blue ;
https://www.hoyogo.com/Products/HYG909R04004A.html

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