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Layer: 2L ; Base Material: FR4 ; Board Thickness: 1.6mm ; Final Copper Thickness: 2OZ ; Surface Finished: ENIG+Gold Finger ; Unit Size(mm): 101.59*101.59 ; Panel Size(mm): 218.44*218.44 ; Min W/S(mil): 8/8 ; Min Hole Size: 0.2mm ;
https://www.hoyogo.com/Products/HYG026R02009B-Gold-Finger.htmlLayer: 8L ; Base Material: FR4 TG150 CT1＞175 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG+Gold Finger ; Unit Size(mm): 120.0*78.0 ; Panel Size(mm): 120.0*78.0 ; Min W/S(mil): 8/8 ; Min Hole Size: 0.2mm ; Solder M...
https://www.hoyogo.com/Products/HYG892R08346A.html
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