Layer: 4L
Base Material: FR4 TG130
Board Thickness: 1.7mm
Final Copper Thickness: 2OZ
Surface Finished: ENIG
Unit Size(mm): 48.4*21.0
Panel Size(mm): 247.6*200.0
Min W/S(mil): 7.9/8
Min Hole Size: 0.25mm
Solder Mask Thickness: Line Angle 10um(min)
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.