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Layer: 6L ; Base Material: FR4 TG150 ; Board Thickness: 1.62mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 147.0*75.0 ; Panel Size(mm): 161.0*166.1 ; Min W/S(mil): 7/7 ; Min Hole Size: 0.3mm ; Special Request: Plug Via With Solder Mask ;
https://www.hoyogo.com/Products/HYG807R06043B.htmlLayer: 2L ; Base Material: FR4 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 138.43*220.98 ; Panel Size(mm): 238.78*156.23 ;
https://www.hoyogo.com/Products/HYG026R02011A.htmlLayer: 2L ; Base Material: FR4 ; Board Thickness: 2.0mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 7.5*15.0 ; Panel Size(mm): 187.0*60.0 ; Solder Mask: White ;
https://www.hoyogo.com/Products/HYG886R02003A.htmlLayer: 4L ; Base Material: FR4 TG130 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: HASL Lead ; Unit Size(mm): 192.0*111.4 ; Panel Size(mm): 192.0*121.4 ; Min W/S(mil): 6/9 ; Min Hole Size: 0.2mm ;
https://www.hoyogo.com/Products/HYG807R04008A.htmlLayer: 2L ; Base Material: FR4 TG130 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 216.0*74.0 ; Panel Size(mm): 216.0*238.0 ; Solder Mask: White ;
https://www.hoyogo.com/Products/HYG089R02273A.htmlLayer: 2L ; Base Material: FR4 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 74.5*290.0 ; Min W/S(mil): 5.9/7.8 ; Min Hole Size: 0.2mm ; Special Request: If vias diameter ≤0.5mm don't have solder mask opening, we will plug them with solder mask. ;
https://www.hoyogo.com/Products/HYG528R04356A.htmlLayer: 6L ; Base Material: FR4 TG135 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 150.0*100.0 ; Min Hole Size: 0.3mm ;
https://www.hoyogo.com/Products/HYG306R06005B.htmlLayer: 4L ; Base Material: FR4 CT1≥175 ; Board Thickness: 2.0mm ; Final Copper Thickness: 2OZ ; Surface Finished: ENIG ; Unit Size(mm): 92.99*48.01 ; Panel Size(mm): 109.0*268.0 ; Min Hole Size: 0.2mm ;
https://www.hoyogo.com/Products/HYG293R04003B.htmlLayer: 4L ; Base Material: FR4 TG130 ; Board Thickness: 1.7mm ; Final Copper Thickness: 2OZ ; Surface Finished: ENIG ; Unit Size(mm): 48.4*21.0 ; Panel Size(mm): 247.6*200.0 ; Min W/S(mil): 7.9/8 ; Min Hole Size: 0.25mm ; Solder Mask Thickness: Line Angle 10um(min) ;
https://www.hoyogo.com/Products/HYG089R04245B.htmlLayer: 2L ; Base Material: FR4 TG130 ; Board Thickness: 0.4mm ; Final Copper Thickness: 1OZ ; Surface Finished: HASL Lead Free ; Unit Size(mm): 20.83*15.0 ; Panel Size(mm): 100.0*153.0 ; Min W/S(mil): 10/6 ; Min Hole Size: 0.2mm ;
https://www.hoyogo.com/Products/HYG293R02303A.htmlLayer: 6L ; Base Material: FR4 ; Board Thickness: 2.0mm ; Final Copper Thickness: 3OZ ; Surface Finished: HASL Lead Free ; Unit Size(mm): 306.88*189.38 ;
https://www.hoyogo.com/Products/HYG898R06169B.htmlLayer: 4L ; Base Material: FR4 TG130 ; Board Thickness: 1.6mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 50.0*71.5 ; Min W/S(mil): 6/6 ; Min Hole Size: 0.2mm ;
https://www.hoyogo.com/Products/HYG021R04022B.html
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