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HYG1282F01001D|PI+SUS

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HYG1282F01001D|PI+SUS
HYG1282F01001D|PI+SUS
HYG1282F01001D|PI+SUS
Product Details

Layer : 1L

Base Material : PI

Board Thickness : 0.15mm

Unit Size(mm) : 20.08*74.73

Panel Size(mm) : 103.0*246.0

Surface Finishing: ENIG

Copper : 1OZ

Min W/S(mil) : 10/10

Solder Mask : Yellow Coverlay

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UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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