Layer: 14L
Base Material: FR4
Board Thickness: 2.13mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG+Impedance control
Unit Size(mm): 140.0*127.0
Panel Size(mm): 165.4*152.4
Min W/S(mil): 3.8/4.0
Min Hole Size: 0.2mm
Solder Mask Thickness: 10-50um
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.