Layer: 14L ; Base Material: FR4 ; Board Thickness: 2.13mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG+Impedance control ; Unit Size(mm): 140.0*127.0 ; Panel Size(mm): 165.4*152.4 ; Min W/S(mil): 3.8/4.0 ; Min Hole Size: 0.2mm ; Solder Mask Thickness: 10-50um ;