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HYG885F01009A

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HYG885F01009A
Product Details

Layer: 1L

Base Material: PI+FR4

Board Thickness: 1.1mm

Final Copper Thickness: 1OZ

Surface Finished: ENIG

Unit Size(mm): 470.0*11.0

Panel Size(mm): 500.0*120.21

Min W/S(mil): 9.8/9.8

Special Request: FR4 Stiffener+3M Tape

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UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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