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Layer: 1L ; Base Material: PI+FR4 ; Board Thickness: 1.1mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 470.0*11.0 ; Panel Size(mm): 500.0*120.21 ; Min W/S(mil): 9.8/9.8 ; Special Request: FR4 Stiffener+3M Tape ;
https://www.hoyogo.com/Products/HYG885F01009A.htmlLayer : 4L ; Base Material : FR4 TG150+PI ; Board Thickness : 0.7mm ; Final Copper Thickness : 1OZ ; Surface Finished: ENIG ; Unit Size(mm) : 19.0*154.28 ; Panel Size(mm) : 114.0*196.0 ; Min hole size : 0.2mm ; Min Hole Copper Thickness : 20um ; Min W/S(mil) : 10/7 ;
https://www.hoyogo.com/Products/R-FPCBHYG1103RF04002.htmlLayer: 6L ; Base Material: FR4(TG170)+PI ; Board Thickness: 1.08mm ; Final Copper Thickness: 1oz ; Surface Finished: ENIG ; Unit Size（mm）：140.0*50.0 ; Panel Size（mm）：140.0*200.0 ; Min Hole Size : 0.12mm ; Min Hole Copper Thickness : 20um ; Min W/S(mil): 3.94/3.94 ; Solder Mask: green ; Coverlay: ye...
https://www.hoyogo.com/Products/rigid-flexPCBHYG306R.html
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