Layer: 4L
Base Material: FR4
Board Thickness: 1.5mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 160.0*100.0
Panel Size(mm): 180.0*225.0
Min Hole Size: 0.2mm
Min W/S(mil): 7.87/6.5
Solder Mask: Green matt
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.