Layer: 4L ; Base Material: FR4 ; Board Thickness: 1.5mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 160.0*100.0 ; Panel Size(mm): 180.0*225.0 ; Min Hole Size: 0.2mm ; Min W/S(mil): 7.87/6.5 ; Solder Mask: Green matt ;