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HYG896R02020A|Red Solder Msak

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HYG896R02020A|Red Solder Msak
HYG896R02020A|Red Solder Msak
Product Details

Layer : 2L

Base Material : FR4

Board Thickness : 1.0mm

Final Copper Thickness : 1OZ

Surface Finished : HASL Lead Free

Unit Size(mm) : 38.0*46.5

Panel Size(mm) : 180.0*280.5

Min W/S(mil) : 10/10

Solder Msak : Red

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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