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Layer : 2L ; Base Material : FR4 ; Board Thickness : 1.57mm ; Final Copper Thickness : 1OZ ; Surface Finished: HASL Lead ; Unit Size(mm) : 467.36*134.62 ; Panel Size(mm) : 480.06*147.32 ; Min Hole Copper Thickness : 20um ; Min W/S(mil) : 13/30 ; Solder Mask : Red ;
https://www.hoyogo.com/Products/redsoldermaskHYG882R.htmlLayer : 2L ; Base Material : FR4 ; Board Thickness : 1.6mm ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 107.0*207.0 ; Panel Size(mm) : 217.0*214.0 ; Min Hole Size : 0.4mm ; Solder Mask : Red ;
https://www.hoyogo.com/Products/HYG898R02185B.htmlLayer: 4L ; Base Material: FR4 TG130 ; Board Thickness: 0.8mm ; Final Copper Thickness: 52.9um ; Surface Finished: HASL Lead Free ; Unit Size(mm): 28.0*6.0 ; Panel Size(mm): 74.5*219.0 ; Min W/S(mil): 8/8.9 ; Min Hole Size: 0.25mm ; Solder Mask: Red ;
https://www.hoyogo.com/Products/HYG898R04256B-Red-Solder-Mask.htmlLayer : 2L ; Base Material : FR4 ; Board Thickness : 1.0mm ; Final Copper Thickness : 1OZ ; Surface Finished : HASL Lead Free ; Unit Size(mm) : 38.0*46.5 ; Panel Size(mm) : 180.0*280.5 ; Min W/S(mil) : 10/10 ; Solder Msak : Red ;
https://www.hoyogo.com/Products/HYG896R02020A.htmlBlind&Buried Via ; Layer : 6L ; Base Material : FR4 ; Board Thickness : 0.8mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 24.71*24.71 ; Min Hole Size : 0.1mm ; Min Hole Copper Thickness : 20um ; Min W/S(mil) : 4.7/4.3 ; Solder Mask : Glossy Red ; Special Process : Mi...
https://www.hoyogo.com/Products/HYG1012R06002A.htmlRigid-Flex PCB ; Layer: 6L ; Base Material: FR4 TG150+PI ; Rigid Board Thickness : 2.20mm ; Flex Board Thickness : 0.27mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 186.45*42.50 ; Panel Size(mm): 223.0*248.22 ; Min W/S(mil): 5.9/5.9 ; Solder Mask: Red ;
https://www.hoyogo.com/Products/HYG898RF06278A.html
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