HYG898RF06278A

Product Image

Product Details

Rigid-Flex PCB

Layer: 6L

Base Material: FR4 TG150+PI

Rigid Board Thickness : 2.20mm

Flex Board Thickness : 0.27mm

Final Copper Thickness: 1OZ

Surface Finished: ENIG

Unit Size(mm): 186.45*42.50

Panel Size(mm): 223.0*248.22

Min W/S(mil): 5.9/5.9

Solder Mask: Red

Production process

ISO Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.