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Layer: 4L ; Base Material: FR4 TG150+PI ; Rigid PCB Thickness: 1.6mm | Rigid PCB: 3-4Layer ; Flex PCB + PI Stiffener Thickness: 0.3±0.05mm | Flex PCB: 1-2Layer ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 322.0*27.58 ; Panel Size(mm): 342.0*148.3 ; Min W/S(mil): 10.5/7.5 ;...
https://www.hoyogo.com/Products/HYG306RF04031A.htmlRigid-Flex PCB ; Layer: 4L ; Base Material: FR4 TG150+PI ; Rigid Board Thickness: 0.7mm ; Flex Board Thickness : 0.15mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 19.0*154.3 ; Panel Size(mm): 114.0*196.0 ; Min W/S(mil): 5.9/5.9 ; Min Hole Size: 0.15mm ;
https://www.hoyogo.com/Products/HYG1103RF04002B.htmlRigid-Flex PCB ; Layer: 6L ; Base Material: FR4 TG150+PI ; Rigid Board Thickness : 2.20mm ; Flex Board Thickness : 0.27mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 186.45*42.50 ; Panel Size(mm): 223.0*248.22 ; Min W/S(mil): 5.9/5.9 ; Solder Mask: Red ;
https://www.hoyogo.com/Products/HYG898RF06278A.htmlLayer : 6L ; Base Material+Stack-up : FR4+PI ; Board Thickness : 1.6mm+0.4mm ; Surface Finished : ENIG+Gold Finger ; Min Hole Size : 0.25mm ; Illustration : Industry Control ;
https://www.hoyogo.com/Products/RigidFlexPCB.htmlLayer: 6L ; Base Material: FR4(TG170)+PI ; Board Thickness: 1.08mm ; Final Copper Thickness: 1oz ; Surface Finished: ENIG ; Unit Size（mm）：140.0*50.0 ; Panel Size（mm）：140.0*200.0 ; Min Hole Size : 0.12mm ; Min Hole Copper Thickness : 20um ; Min W/S(mil): 3.94/3.94 ; Solder Mask: green ; Coverlay: ye...
https://www.hoyogo.com/Products/rigid-flexPCBHYG306R.html;
https://www.hoyogo.com/Products/rigid-flexpcb.html;
https://www.hoyogo.com/Products/4L-FlexRigid-flexPCB.htmlRigid-Flex PCB Layer: 4L Base Material: FR4 TG135+PI Rigid Board Thickness: 0.43mm Flex Board Thickness: 0.15mm Surface Finished: ENIG Unit Size(mm): 146.0*10.8 Panel Size(mm): 106.0*91.0 Min W/S(mil): 9.8/8 Finger Area Thickness: 0.33±0.05mm
https://www.hoyogo.com/Rigid-Flex-PCB.htmlRigid-Flex PCB Layer: 4L Base Material: FR4 TG180+PI Rigid Board Thickness: 1.0±0.1mm Flex Board Thickness: 0.18±0.03mm | GTL-L2 Layer Surface Finished: ENIG Unit Size(mm): 61.7*45.4 Panel Size(mm): 81.7*120.0 Min W/S(mil): 5.9/5.9 Min Hole Size: 0.2mm Solder Mask: Green+Yellow
https://www.hoyogo.com/4-Layer-Rigid-Flex-PCB.htmlLayer: 3L Base Material: FR4 TG150+PI Board Thickness: 1.0mm Surface Finished: ENIG+Impedance Control Unit Size(mm): 76.53*22.77 Min W/S(mil): 3.94/5.3 Min Hole Size: 0.1mm Solder Mask: Green+Yellow Coverlay
https://www.hoyogo.com/3-Layer-Rigid-flex-PCB.html
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