Red solder mask|HYG882R02005A

Product Image

Product Details

Layer : 2L

Base Material : FR4

Board Thickness : 1.57mm

Final Copper Thickness : 1OZ

Surface Finished: HASL Lead

Unit Size(mm) : 467.36*134.62

Panel Size(mm) : 480.06*147.32

Min Hole Copper Thickness : 20um

Min W/S(mil) : 13/30

Solder Mask : Red

Production process

ISO Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.