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Products

HYG898R04256B | Red Solder Mask

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HYG898R04256B | Red Solder Mask
Product Details

Layer: 4L

Base Material: FR4 TG130

Board Thickness: 0.8mm

Final Copper Thickness: 52.9um

Surface Finished: HASL Lead Free

Unit Size(mm): 28.0*6.0

Panel Size(mm): 74.5*219.0

Min W/S(mil): 8/8.9

Min Hole Size: 0.25mm

Solder Mask: Red

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UL Certification

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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