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Customer service hotline:+86 13723413985 or 400 058 2288
Blind&Buried Via
Layer : 6L
Base Material : FR4
Board Thickness : 0.8mm
Final Copper Thickness : 1OZ
Surface Finished : ENIG
Unit Size(mm) : 24.71*24.71
Min Hole Size : 0.1mm
Min Hole Copper Thickness : 20um
Min W/S(mil) : 4.7/4.3
Solder Mask : Glossy Red
Special Process : Min. hole size 0.1mm0.25mm via plug with resign
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.
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