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Layer : 10L ; Base Material : FR4 TG150 ; Stack-Up : 2 Step(2+6+2) ; Board Thickness : 0.8mm ; Surface Finished : ENIG+OSP ; Min Hole Size : 0.1mm ; Application : Intelligent Mobile Phone ;
https://www.hoyogo.com/Products/10LHDIPCB.htmlBlind&Buried Via ; Layer : 6L ; Base Material : FR4 ; Board Thickness : 0.8mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 24.71*24.71 ; Min Hole Size : 0.1mm ; Min Hole Copper Thickness : 20um ; Min W/S(mil) : 4.7/4.3 ; Solder Mask : Glossy Red ; Special Process : Mi...
https://www.hoyogo.com/Products/HYG1012R06002A.htmlLayer : 8L ; Base Material : FR4 ; Stack-Up : 2 Step(2+4+2) ; Board Thickness : 1.6mm ; Surface Finished : ENIG ; Min Hole Size : 0.15mm ; Application : Industrial instrument ;
https://www.hoyogo.com/Products/8LHDIPCB.htmlSpecial Request: 1. Impedance Control PCB, 4 groups of single impedance control, 4 groups of differential impedance control. 2. 2-step HDI Laser Blind Buried Via PCB; 3. Outer Final Copper Thickness: 1OZ, Inner Final Copper Thickness: 0.5OZ; 4. The surface finished of the BGA...
https://www.hoyogo.com/HYG2012R08002A.html
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