HYG2012R08002A

Product Image

Product Details

Special Request:
1. Impedance Control PCB,
4 groups of single impedance control,
4 groups of differential impedance control.
2. 2-step HDI Laser Blind Buried Via PCB;
3. Outer Final Copper Thickness: 1OZ,
Inner Final Copper Thickness: 0.5OZ;
4. The surface finished of the BGA area is OSP,
and the surface finished of the remaining areas is ENIG.

Layer: 8L
Base Material: FR4 TG150
Board Thickness: 1.6mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG+OSP
Unit Size(mm): 65.00*50.00
Min. W/S(mil): 3/3

Production Process

ISO Certification

UL Certification

Application areas

Who will be our parters

FAQ

What kind of board can you offer? How about the layer count and base material?
HoYoGo can offer board of HDI, gold finger, hard gold, flexible, flex-rigid, metal base, quick-turn around and PCBA. The layer is normally from 1 to 28layer. The base material also depends on the requirement, it can be KB or shengyi, etc.

Contact us

Welcome to the HOYOGO website!

HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.

Tags:HDI PCB Blind Buried Via PCB