Blind Buried Via PCB

HYG2012R08002A

Special Request:  1. Impedance Control PCB,  4 groups of single impedance control,  4 groups of differential impedance control. 2. 2-step HDI Laser Blind Buried Via PCB; 3. Outer Final Copper Thickness: 1OZ,  Inner Final Copper Thickness: 0.5OZ; 4. The surface finished of the BGA...