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Layer : 8L ; Base Material : FR4 ; Board Thickness : 1.65mm ; Final Copper Thickness : 1OZ ; Surface Finished : ENIG ; Unit Size(mm) : 66.5*63.0 ; Panel Size(mm) : 133.0*146.0 ; Min W/S(mil) : 7/7 ; Min Hole Size : 0.2mm ; Solder Mask : Green Matt ;
https://www.hoyogo.com/Products/HYG898R08005A.htmlLayer : 8L ; Base Material : FR4 ; Board Thickness : 1.6mm ; Surface Finished : ENIG+Impedance control ; Unit Size(mm) : 70.0*158.0 ; Min W/S(mil) : 148.0*174.0 ; Final Copper Thickness : min 33.4um ; Min W/S(mil) : 3.9/3.9 ; Special Request : BGA ;
https://www.hoyogo.com/Products/HYG528R08381A.html
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