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HYG528R08381A|BGA|Impedance control

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HYG528R08381A|BGA|Impedance control
HYG528R08381A|BGA|Impedance control
HYG528R08381A|BGA|Impedance control
Product Details

Layer : 8L

Base Material : FR4

Board Thickness : 1.6mm

Surface Finished : ENIG+Impedance control

Unit Size(mm) : 70.0*158.0

Min W/S(mil) : 148.0*174.0

Final Copper Thickness : min 33.4um

Min W/S(mil) : 3.9/3.9

Special Request : BGA

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HONGKONG HOYOGO TECHNOLOGY CO.,LTD

SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD

Tel : (+86)-755-2300 1582

Fax : (+86)-755-2720 6126

Email : sales@hygpcb.com

Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.


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