Layer : 8L
Base Material : FR4
Board Thickness : 1.6mm
Surface Finished : ENIG+Impedance control
Unit Size(mm) : 70.0*158.0
Min W/S(mil) : 148.0*174.0
Final Copper Thickness : min 33.4um
Min W/S(mil) : 3.9/3.9
Special Request : BGA
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.