Layer : 1L ; Base Material : Cu Base ; Board Thickness : 4.0mm ; Surface Finished : ENIG ;
https://www.hoyogo.com/Products/4mmCuBasePCB.htmlLayer : 4L ; Base Material : FR4+CU Base 390w/mk ; Board Thickness : 2.2mm ; Surface Finished : ENIG ; Min Hole Size : 0.1mm ; Application : Stage Lighting ; Special Process : Countersunk Hole ;
https://www.hoyogo.com/Products/FR4CUBase.htmlLayer: 1L ; Base Material: Copper Base ; Board Thickness: 1.5mm ; Final Copper Thickness: 1OZ ; Surface Finished: OSP ; Unit Size(mm): 18.5*18.5 ; Panel Size(mm): 185.0*158.0 ; Min W/S(mil): 10/7.9 ; Solder Mask: PM-500WD-85SF ;
https://www.hoyogo.com/Products/HYG293C01355A.html