Layer: 1L
Base Material: Copper Base
Board Thickness: 1.5mm
Final Copper Thickness: 1OZ
Surface Finished: OSP
Unit Size(mm): 18.5*18.5
Panel Size(mm): 185.0*158.0
Min W/S(mil): 10/7.9
Solder Mask: PM-500WD-85SF
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add :A/7F, Kechuang Building, Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen 518104/ P.R.C.