Layer: 1L ; Base Material: Copper Base ; Board Thickness: 1.5mm ; Final Copper Thickness: 1OZ ; Surface Finished: OSP ; Unit Size(mm): 18.5*18.5 ; Panel Size(mm): 185.0*158.0 ; Min W/S(mil): 10/7.9 ; Solder Mask: PM-500WD-85SF ;