Layer: 1L ; Base Material: Copper Base ; Board Thickness: 1.5mm ; Final Copper Thickness: 1OZ ; Surface Finished: OSP ; Unit Size(mm): 18.5*18.5 ; Panel Size(mm): 185.0*158.0 ; Min W/S(mil): 10/7.9 ; Solder Mask: PM-500WD-85SF ;
https://www.hoyogo.com/Products/HYG293C01355A.htmlLayer: 1L Base Material: Cu (Dielectric Thickness: 0.1mm+/-20%, Thermal Conductivity: 18W/m·k) Board Thickness: 1.5mm Final Copper Thickness: 1OZ Surface Finished: OSP Unit Size(mm): 36.00*42.00 Solder Mask: White
https://www.hoyogo.com/Copper-Base-PCB-HYG2685C01067A.html