FR4 Stiffener PCB

HYG1281F02011A

Layer: 2L ; Base Material: PI ; Board Thickness: 0.22mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 61.3*46.0 ; Panel Size(mm): 290.0*172.6 ; Min W/S(mil): 7.9/7.8 ; Min Hole Size: 0.3mm ; Solder Mask: Yellow Coverlay ; Special Request: FR4 Stiffener+3M Tape ;