Layer: 2L
Base Material: PI
Board Thickness: 0.22mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 61.3*46.0
Panel Size(mm): 290.0*172.6
Min W/S(mil): 7.9/7.8
Min Hole Size: 0.3mm
Solder Mask: Yellow Coverlay
Special Request: FR4 Stiffener+3M Tape
Welcome to the HOYOGO website!
HONGKONG HOYOGO TECHNOLOGY CO.,LTD
SHENZHEN HOYOGO ELECTRONIC TECHNOLOGY CO.,LTD
Tel : (+86)-755-2300 1582
Fax : (+86)-755-2720 6126
Email : sales@hygpcb.com
Add: 7A Quanzhi Science and Technology Innovation Park,Shajing Street, Bao'an District, Shenzhen. 518104/ P.R.C.