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Layer : 2L ; Base Material : PI ; Board Thickness : 0.28mm ; Final Copper Thickness: 65um ; Surface Finished : ENIG ; Unit Size(mm) : 401.95*434.99 ; Panel Size(mm) : 401.95*434.99 ; Min Hole Copper Thickness : 20um ; Min W/S(mil) : 8/8 ; Coverlay : Yellow ; FR4 stiffener ; base material brand : SF...
https://www.hoyogo.com/Products/FR4stiffenerHYG528F0.htmlLayer: 2L ; Base Material: PI ; Board Thickness: 0.22mm ; Final Copper Thickness: 1OZ ; Surface Finished: ENIG ; Unit Size(mm): 61.3*46.0 ; Panel Size(mm): 290.0*172.6 ; Min W/S(mil): 7.9/7.8 ; Min Hole Size: 0.3mm ; Solder Mask: Yellow Coverlay ; Special Request: FR4 Stiffener+3M Tape ;
https://www.hoyogo.com/Products/HYG1281F02011A.htmlLayer: 2L Base Material: PI+FR4 Stiffener Board Thickness: 0.18mm Final Copper Thickness: 25UM Surface Finished: Immersion Tin Unit Size(mm): 57.85*36.75 Panel Size(mm): 137.0*206.0 Coverlay: Yellow
https://www.hoyogo.com/FR4-Stiffener-FPC.htmlFR4 Stiffener FPC Layer: 2L Base Material: PI+FR4 Stiffener Board Thickness: 0.18mm Final Copper Thickness: 25um Surface Finished: ENIG Unit Size(mm): 57.85*36.75 Panel Size(mm): 137.0*206.0 Solder Mask: Green+Yellow
https://www.hoyogo.com/FR4-Stiffener-Flex-PCB.html
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